MEDIA RELEASE PR41168
KYOCERA ELCO Develops Ultra-Low Profile 5803 Series 0.4mm-Pitch Board-to-Board Connector
YOKOHAMA, Japan, Sept. 10 /PRNewswire-AsiaNet/ --
Achieving industry's lowest-class stacking height (0.5mm), and smallest
depth (2.4mm)
Kyocera Elco Corporation (Headquarters: Yokohama, Japan; President: Yoji
Date) announced today that it has developed the 5803 Series 0.4mm-Pitch
Board-to-Board Connector, which achieves the industry's lowest-class stacking
height at 0.5mm, and the smallest depth* at 2.4mm. Samples of the new product
will be available starting September 9, 2010.
While further miniaturization and multifunctionality have continually
been required in consumer electronic equipment such as cell phones,
smartphones, digital still cameras(DSC), digital video cameras (DVC), digital
audio players and game consoles; in recent years, the number of components
incorporated into such equipment has also increased.
Under these conditions, miniaturization of components is also demanded to
make effective use of the limited space on boards.
The newly developed 5803 Series has achieved the smallest-class profile
in the industry, with a distance between boards of only 0.5mm when the plug
and receptacle connectors are mated, and at 2.4mm, has the smallest depth in
the industry. These properties allow for further space-saving on boards, as
well as its low profile contributes to slim design capabilities.
The 5803 Series increases freedom in designing pattern layouts on the
board, because with no contact exposed on the connector bottom with the
insulator housing, the circuit insulation between the connector and a board
is assured. Furthermore, reliable contact performance is realized with
Kyocera Elco's original contact structure which removes foreign matter such
as splashes of solder flux in the soldering process and particles inboard
splitting.
Kyocera Elco Corporation is contributing to the further miniaturization
of consumer electronic equipment with the launch of the new 5803 Series.
* Based on research by Kyocera Elco Corporation; as of September, 2010.
Product Outline
Product name: 5803 Series 0.4mm-Pitch Board-to-Board Connector
Specifications:
No. of Positions 10 to 60
Stacking Height 0.5mm
Contact Pitch 0.4mm
Rated Current DC 0.3A
Rated Voltage DC 50V
D. W. Voltage AC 250Vrms/min
Contact Material Copper alloy
Insulator Material Heat-resistant plastic
Features:
1. Ultra-low profile board-to-board connector contributes to optimal
space saving
Ultra-low profile and space-saving board-to-board connector with
0.4mm-pitch, 0.5mm stacking height, and 2.4mm depth.
2. Good operability
Mating is perceivable with a secure "click-feeling" with structural
protrusion on contacts of both plug and receptacle connectors.
3. Dual-contacting structure improves mating reliability
A pinching type, that is highly resistant to impact and drop shock, is
adopted for the dual-contacting structure. Due to the touch of the contact
tip on the inner wall of the insulator housing, mating wobble is restrained
and the mating stability improves accordingly.
4. Proprietary contact structure improves contact reliability
Reliable contacting is realized with the wiping effect; removing foreign
matter such as splashes of flux, particles of boards splitting through
increased concentrated load.
5. Increased freedom in pattern layout on boards
No contact exposed on the bottom of both the plug and receptacle
connectors enables pattern layout all over a board, thus increasing freedom
in pattern layout on boards.
6. Structurally prevents solder-wicking
The insert-molding process prevents the solder wicking on plug
connectors, and the nickel barrier on contacts prevents the solder wicking on
receptacle connectors.
7. 3,000 connectors contained in reel of embossed tape for automatic
mounting machines.
8. RoHS-compliant
SOURCE: Kyocera
CONTACT:
Product specification inquiries from customers or the media:
Chihiro Matsui - Marketing Dept., KYOCERA ELCO Corporation
TEL: 045-943-2946
FAX: 045-943-2910
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