MEDIA RELEASE PR40402
Novellus Announces New Suite of Products for the Advanced Wafer Level Packaging
Market
SAN JOSE, Calif., July 13 /PRNewswire-AsiaNet/ --
VECTOR(R) 3D, INOVA(R) 3D, and G3D(TM) Models Complement Recently-announced
SABRE(R) 3D System
Novellus Systems (Nasdaq: NVLS) today introduced new models of the company's
VECTOR PECVD, INOVA PVD, and GxT photoresist strip systems. The new models leverage
Novellus' advanced interconnect technology to address the evolving requirements of
the wafer level packaging (WLP) market. In order to meet the technical challenges of
3D integration, each of these systems incorporates capabilities previously
unavailable in conventional packaging equipment, while concurrently delivering
industry-leading productivity.
Consumer demand for smaller, more powerful mobile electronics, as well as faster
logic and memory chips, is driving the development of alternate packaging
technologies that reduce power consumption, increase system-in-package performance,
and shrink the form factor. Compared to conventional die packaging, 3D integration
technologies like through-silicon vias (TSV) and WLP stacking schemes enable shorter
chip-to-chip interconnections that lead to significant performance gains. TSVs allow
multiple chips to be stacked vertically in a "sandwich-like" structure and
interconnected across very short distances with cross-device copper vias. WLP
technologies such as micro-bumps, pillars and copper redistribution layers (RDL)
enable increasing I/O counts and decreasing pitch requirements. All of these 3D
integration schemes are driving new metal and dielectric interconnect materials and
applications.
Novellus has leveraged its interconnect technology leadership to develop a new
suite of products that meet both the technological needs and the manufacturing cost
constraints of the wafer level packaging market. The newly-introduced SABRE 3D system
incorporates state-of-the-art SABRE Electrofill(R) technology and sets a new industry
benchmark for performance and cost-effectiveness. This innovative system includes
new, patented technologies like Advanced Pretreatment Technology (APT(TM)) for void-
free filling, XMM(TM) for reduced copper overburden, and TurboCell(TM) technology for
improved fill uniformity at higher throughputs. SABRE 3D's modular architecture can
be configured with multiple plating and pre-or-post-treatment cells for a variety of
packaging applications including TSV, pillar, RDL, under-bump metallization, and
eutectic and lead-free micro-bumping using materials such as copper, tin, nickel, and
tin silver.
The INOVA 3D PVD system uses Novellus' next-generation patented HCM(R) sputtering
source coupled with the company's IONFLO(TM) technology to provide superior copper
sidewall coverage and ultra-low defects in high aspect ratio TSVs. The ion-induced
copper flow process enables void-free fill to be achieved while using a much thinner
seed layer as compared to competitive PVD approaches. This reduces the manufacturing
cost of consumables for the TSV PVD process step by greater than 50 percent. INOVA 3D
also offers IONX(TM) titanium and IONX(TM) XL tantalum source technology that extends
target life to greater than 10,000 kW-hrs, resulting in increased uptime and further
reducing the overall cost of consumables for this application.
The VECTOR 3D system utilizes the same patented multi-station sequential
deposition (MSSD) technology incorporated into more than 1000 VECTOR PECVD tools
worldwide. The MSSD architecture, coupled with newly-developed PECVD processes,
enables VECTOR 3D to deposit low-cost, low-temperature films that are compatible with
bonded substrates. Low-temperature applications include silicon nitride diffusion
barriers and silicon oxide isolation and passivation layers. The system incorporates
technology to tune the hermiticity and electrical performance of these layers to
match the film quality typically obtained with a higher temperature dielectric
deposition. VECTOR 3D is also designed for depositing high quality dielectric liners
for TSV structures used in both via-middle and via-last integration schemes.
The G3D photoresist strip system has been designed to quickly remove thick (20-
100 micron) photoresists used in the manufacture of RDLs and pillars and to achieve
residue-free strip and clean of high aspect ratio TSVs. G3D's competitive edge comes
from a unique combination of high productivity, low temperature processing, and a
deep cleaning capability that's enabled by the system's high ash rate inductively-
coupled plasma (ICP) source. The ICP source provides ultra-uniform plasma for
consistent resist removal and elimination of post-strip residue. With flexible RF
power and gas distribution controls, and a low temperature processing capability, the
G3D affords a wide process window for residue-free removal at industry-leading
throughputs.
"Wafer level packaging is driving new technology requirements that leverage
Novellus' core interconnect competencies in ECD, PECVD, PVD, and photoresist strip,"
said Dr. Fusen Chen, executive vice president, semiconductor system products. "We
have developed a suite of products and applications that apply our advanced
deposition and strip technology to the new demands of 3D integration."
About Novellus:
Novellus Systems, Inc. (NASDAQ: NVLS) is a leading provider of advanced process
equipment for the global semiconductor industry. An S&P 500 company, Novellus is
headquartered in San Jose, Calif. with subsidiary offices across the globe. For more
Novellus, VECTOR, SABRE, SABRE Electrofill, HCM, and INOVA are registered
trademarks;., and APT, XMM, TurboCell, IONX, IONFLO, and G3D are trademarks of
Novellus Systems, Inc.
SOURCE: Novellus Systems, Inc.
CONTACT: Bob Climo of Novellus Systems, Inc.,
+1-408-943-9700,
bob.climo@novellus.com;
or Sarmishta Ramesh of The Hoffman Agency
+1-303-327-5459,
sramesh@hoffman.com,
for Novellus Systems, Inc.
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