MEDIA RELEASE PR40400
Novellus Introduces SABRE(R) 3D Electroplating System for the Advanced Wafer-Level
Packaging Market
SAN JOSE, Calif., July 13 /PRNewswire-AsiaNet/ --
Highly Productive, Modular Platform Delivers Technology to Enable 3D Integration
Novellus Systems (Nasdaq: NVLS) today introduced the SABRE 3D electroplating
system for the rapidly-growing advanced wafer-level packaging (WLP) market. Utilizing
technology from Novellus' industry-leading SABRE Electrofill(R) copper damascene
interconnect system, SABRE 3D's flexible and modular architecture delivers a range of
high-productivity WLP processes, including copper through-silicon vias (TSV), copper
redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-
bumping. The new SABRE 3D platform incorporates technological advances specifically
designed to enable the tighter interconnect pitches, higher production yields,
improved uniformities, and reduced costs driven by advanced WLP applications.
TurboCell(TM) technology for high rate electroplating, Advanced Pretreatment
Technology (APT(TM)) for robust wetting, and XMM(TM) overburden reduction are just
some of the new innovations employed by SABRE 3D.
Strong demand for more powerful mobile electronics is driving the development of
alternate packaging technologies that enable faster device speeds, increased
functionality and I/O density, lower power consumption, and minimized form factor. 3D
integration has emerged to meet these demands with the promise to be more cost-
effective than conventional 2D scaling and is driving an ever-increasing need for
innovation in WLP applications.
SABRE 3D was designed to meet the emerging needs of the advanced WLP market with
an innovative, flexible, and modular architecture that maximizes footprint density,
enables configurable multi-layer processing, and supports field extendibility for
seamless capacity expansion. The field-configurable design also simplifies the
transition from the development environment to high volume manufacturing. SABRE 3D
incorporates many of the same technologies that have made the SABRE platform the
industry-leader in electrochemical deposition reliability and manufacturability.
SABRE's sealed dry contacts, innovative clamshell and cell design, SmartDose(R) bath
control, and precision wafer handling have been integrated into the new SABRE 3D
platform.
New technology innovations are central to SABRE 3D's benchmark-setting technical
performance and productivity. Through targeted development of Electrofill chemistry
and processes, SABRE 3D delivers void-free TSV fill and improves TSV integration by
reducing thermally-induced via protrusion. Advanced Pretreatment Technology (APT(TM))
ensures robust wetting and consistent fill initiation, resulting in plating times up
to 50 percent faster than competing offerings. Novellus' XMM(TM) technology, an in-
line isotropic wet etch process, enables independent control of plated copper fill
and overburden and reduces CMP cost of consumables by up to 70 percent. Additionally,
Novellus has developed new, proprietary TurboCell(TM) technology for through-resist
plating applications that dramatically improves film uniformity and alloy consistency
while providing exceptionally high plating rates.
"The new SABRE 3D platform leverages over 12 years of industry-leading
electroplating technology and experience to address the emerging requirements of the
advanced WLP market," said Sesha Varadarajan, vice president and general manager of
Novellus' Electrofill business unit. "SABRE 3D's innovative design and feature set
support a range of applications for 3D integration where technology and cost are
equally important."
About Novellus' ECD Technology:
For high-volume manufacturing applications at 45nm and beyond, Novellus' advanced
copper electrochemical deposition hardware, processes, and chemistries combine
industry-leading throughput with bottom-up void-free filling of advanced device
structures. Nine out of ten copper interconnect wafers in the world are manufactured
on Novellus SABRE Electrofill(R) systems.
About Novellus:
Novellus Systems, Inc. (NASDAQ: NVLS) is a leading provider of advanced process
equipment for the global semiconductor industry. An S&P 500 company, Novellus is
headquartered in San Jose, Calif. with subsidiary offices across the globe. For more
Novellus, SABRE, Electrofill, and SmartDose are registered trademarks; and
TurboCell, APT, and XMM are trademarks of Novellus Systems, Inc.
SOURCE: Novellus Systems, Inc.
CONTACT: Bob Climo of Novellus Systems, Inc.,
+ 1-408-943-9700,
bob.climo@novellus.com;
or Sarmishta Ramesh of The Hoffman Agency,
+1-303-327-5459,
sramesh@hoffman.com,
for Novellus Systems, Inc.
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